موقعك الحالي:صفحة رئيسية>المنتجات
The edge grinding process is very important in the wafer manufacturing process, which affects the yield of wafer and the processing time of post process. With the Low Damage
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The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated
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Edge Grinding of Notch *Actual Measured Data of Edge Grinding with W-GM The notch depth, angle and corner radius (R) are measured, and the stable shaping accuracy is
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Edge Grinding of Silicon Wafer. Mirror finish edge grinding of Ra = 20 nm is achieved by our helical grinding technology. It is capable with as-cut wafer, lapped wafer and etched wafer. Wafer Size: 2″ to 18″. Shrinking of
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Feature. Sapphire has advantages with mechanical stability, heat resistance, chemical stability and transparency, and it is widely used as a substrate and polarizer board for
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2007年1月24日 磨削加工中，grinding, lapping, polishing的字面上的翻译都是“研磨”，但实际上他们好像的精密磨削加工的三个不同的步骤？. 具体是怎么区别的呢？. #热议# 普通
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2020年3月21日 In Fig. 1, we show the profile of a deep thread and the position of the cutting edge. Zone I corresponds to the tolerance on the part and zone II to the tolerance
Read MoreShaping: We provide everything you need for scarfing, shaping, defurring, feathering and finishing stone surfaces and edges-Super-Rok™ diamond discs, Genesis™ diamond
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Wafer Edge Grinding Machine W-GM-4200 Series (4200E, 4250) 2 Grinding Stages with 4-cassette Loader. It’s a machine of W-GM series for 2″ to 8″ wafer production. Easy operation by touch screen and the
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4.1.4 Edge grinding. Silicon wafers after cutting have sharp edges, and they chip easily. The wafer edge is shaped to remove sharp, brittle edges; rounded edges minimize the risk for slipping, too. The edge-shaping operation makes the wafer perfectly round (off-cut wafers are oval shaped after slicing), the diameter is adjusted, and orientation ...
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Feature. Sapphire has advantages with mechanical stability, heat resistance, chemical stability and transparency, and it is widely used as a substrate and polarizer board for blue and white LED production. Sapphire is very hard and difficult to cut material though, smooth finish can be achieved with the high accuracy and high rigid grinding ...
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With the high accuracy and high rigid grinding system of our edge grinder, smooth finish can be achieved even with SiC wafer that is difficult to cut material. Example of Edge Shape (Cross Section) R-type T-type Asymmetric Capable with R-type, T-type and asymmetric shape with easy operation.
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Edge Grinding of Silicon Wafer. Mirror finish edge grinding of Ra = 20 nm is achieved by our helical grinding technology. It is capable with as-cut wafer, lapped wafer and etched wafer. Wafer Size: 2″ to 18″. Shrinking of wafer size such as
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2020年3月21日 The factors affecting the shaping of the cutting edge in the incision of a deep thread are analyzed: the tolerance on the thread profile; the error in cutter setup; the sharpening error; and the margin in grinding for high-precision threads.
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Edge Profiling I Lapping I I Etching 1 Cleaning I FIG. 2. CONVENTIONAL WAFER SHAPING PROCESSES (AFTER VANDAMME, XIN AND PEI, 2000; PEI ET AL., 1999). To turn a silicon crystal ingot into wafers with satisfactory quality, a sequence of processes will be needed. As shown in Fig. 2, this typically consists
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2017年1月27日 Grinding, one of the “Shaping” functions of Technology Cycles, enables grinding on 5-axis machines and machining centers. Conversational programming software for grinding embedded in 5-axis machines and machining centers enables both cutting and grinding on one machine.
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Sharpening vs shaping: When shaping a tool, you remove steel to get your desired shape and edge angle. You can do both shaping and sharpening on your Tormek. Simple honing on the inside of arched edges, ... The Tormek way of sharpening differs from other grinding methods like high-speed bench grinders and belt sanders.
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In the context of machining, a cutting tool or cutter is typically a hardened metal tool that is used to cut, shape, and remove material from a workpiece by means of machining tools as well as abrasive tools by way of shear deformation.The majority of these tools are designed exclusively for metals.. There are several different types of single-edge cutting tools that
Read More2020年3月21日 The factors affecting the shaping of the cutting edge in the incision of a deep thread are analyzed: the tolerance on the thread profile; the error in cutter setup; the sharpening error; and the margin in grinding for high-precision threads.
Read More4.1.4 Edge grinding. Silicon wafers after cutting have sharp edges, and they chip easily. The wafer edge is shaped to remove sharp, brittle edges; rounded edges minimize the risk for slipping, too. The edge-shaping operation makes the wafer perfectly round (off-cut wafers are oval shaped after slicing), the diameter is adjusted, and orientation ...
Read MoreWith the high accuracy and high rigid grinding system of our edge grinder, smooth finish can be achieved even with SiC wafer that is difficult to cut material. Example of Edge Shape (Cross Section) R-type T-type Asymmetric Capable with R-type, T-type and asymmetric shape with easy operation.
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Edge Grinding of Sapphire Wafer Process for Brittle Materials Wafer Size: 2 inch～8 inch OF / Notch Customer Support Feature Sapphire has advantages with mechanical stability, heat resistance, chemical stability and transparency, and it is widely used as a substrate and polarizer board for blue and white LED production.
Read MoreEdge Grinding of Silicon Wafer. Mirror finish edge grinding of Ra = 20 nm is achieved by our helical grinding technology. It is capable with as-cut wafer, lapped wafer and etched wafer. Wafer Size: 2″ to 18″. Shrinking of wafer size such as
Read MoreEdge Profiling I Lapping I I Etching 1 Cleaning I FIG. 2. CONVENTIONAL WAFER SHAPING PROCESSES (AFTER VANDAMME, XIN AND PEI, 2000; PEI ET AL., 1999). To turn a silicon crystal ingot into wafers with satisfactory quality, a sequence of processes will be needed. As shown in Fig. 2, this typically consists
Read More2017年1月27日 Grinding, one of the “Shaping” functions of Technology Cycles, enables grinding on 5-axis machines and machining centers. Conversational programming software for grinding embedded in 5-axis machines and machining centers enables both cutting and grinding on one machine.
Read MoreSharpening vs shaping: When shaping a tool, you remove steel to get your desired shape and edge angle. You can do both shaping and sharpening on your Tormek. Simple honing on the inside of arched edges, ... The Tormek way of sharpening differs from other grinding methods like high-speed bench grinders and belt sanders.
Read MoreIn the context of machining, a cutting tool or cutter is typically a hardened metal tool that is used to cut, shape, and remove material from a workpiece by means of machining tools as well as abrasive tools by way of shear deformation.The majority of these tools are designed exclusively for metals.. There are several different types of single-edge cutting tools that
Read MoreGrinding process. Grinding is a type of removal process in which a wheel composed of abrasive grains and binders is rotated at high speed, and each randomly arranged abrasive grain acts as a cutting edge to remove a very small amount of material from the surface of the work material. Grinding tools that use diamond or cBN as the abrasive grain ...
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الصين -تشنغ تشو -المنطقة الوطنية للتنمية الصناعية للتكنولوجيا المتطورة، جادة العلوم رقم 169.
الاتصال: 0371-86549132.